收藏本站
MMFT5P03HD
INFORMATION FOR USING THE SOT ? 223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.15
3.8
0.079
2.0
0.248
0.079
2.0
0.091
2.3
0.091
2.3
6.3
0.059
1.5
0.059
1.5
0.059
1.5
inches
mm
SOT ? 223 POWER DISSIPATION
T J(max) ? T A
R θ JA
The power dissipation of the SOT ? 223 is a function of
the drain pad size. This can vary from the minimum pad
size for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T J(max) , the maximum rated junction
temperature of the die, R θ JA , the thermal resistance from
the device junction to ambient, and the operating
temperature, T A . Using the values provided on the data
sheet for the SOT ? 223 package, P D can be calculated as
follows:
P D =
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T A of 25 ° C,
one can calculate the power dissipation of the device which
in this case is 3.13 watts.
P D = 150 ° C ? 25 ° C = 3.13 watts
40 ° C/W
The 40 ° C/W for the SOT ? 223 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 3.13 watts.
There are other alternatives to achieving higher power
dissipation from the SOT ? 223 package. One is to increase
the area of the drain pad. By increasing the area of the drain
pad, the power dissipation can be increased. Although one
can almost double the power dissipation with this method,
one will be giving up area on the printed circuit board
which can defeat the purpose of using surface mount
technology.
Another alternative would be to use a ceramic substrate
or an aluminum core board such as Thermal Clad t . Using
a board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
http://onsemi.com
9
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MMFT960T1 MOSFET N-CH 60V 300MA SOT223
MMG3002NT1 IC AMP RF GP 3600MHZ 5.2V SOT-89
MMG3006NT1 TRANS GPA 33DBM 16-QFN
MMG3007NT1 IC AMP RF GP 6000MHZ 5V SOT-89
MMG3H21NT1 TRANS HBT 20.5DBM 19.3DB SOT-89
MMH3111NT1 TRANS GAAS HFET SOT-89
MML20211HT1 IC LNA 2GHZ 21P1DB 8DFN
MMS-1A-V2 0 SENSOR MICRO MACHINED SMD
相关代理商/技术参数
MMFT5P03HDT3 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS P-CHANNEL FIELD FEECT TRANSISTOR
MMFT6N03HD 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS POWER 6.0 AMPERES 30 VOLTS
MMFT960T1 功能描述:MOSFET 60V 300mA N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMFT960T1_06 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 300 mA, 60 Volts N−Channel SOT−223
MMFT960T1G 功能描述:MOSFET 60V 300mA N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMFTN123 制造商:Diotec Semiconductor 功能描述:
MMFTN138 制造商:Diotec 功能描述:Bulk
MMFTN170 制造商:Diotec Semiconductor 功能描述: